Combined Effects of Ionizing Radiation, Accelerated Aging and
Electromagnetic Interference in Modern ICs: Comprehension and
Fabian Vargas (Pontificia Universidade Catolica do Rio Grande do Sul, Brasil)
Technology scaling, which made electronics accessible and affordable for almost everyone on the globe, has advanced IC and electronics since sixties. Nevertheless, it is well recognized that such scaling has introduced new (and major) reliability challenges to the semiconductor industry. This tutorial addresses the background mechanisms impacting reliability of very deep submicron (VDSM) integrated circuits (ICs). Issues like Total-Ionizing Dose (TID) radiation, Single-Event Effect (SEE), accelerated aging and electromagnetic interference (EMI) are presented and their combined effects on the reliability of modern ICs is discussed. Reliability failure mechanisms for radiation and aging, the way they are modeled and how they are impacting IC lifetime will be covered. Laboratory test setup and recent results from experimental measurements are described. Classic design solutions to counteract with TID, SEE, aging and EMI in VDSM ICs and the recent achievements on the development of on-chip sensors for leveraging of embedded system robustness for critical applications are introduced.